[China Instrument Network Instrumentation Conference] The EC/SMB/SEG7 (Intelligent Manufacturing System Evaluation Team) working group meeting was held in Tokyo, Japan from August 30th to September 1st, 2017, from the United States, Germany, France, China, Japan, Twenty-seven experts from South Korea and other countries attended the meeting. Dr. Wang Chunxi, deputy chief engineer of the Instrument Research Institute, attended the meeting.

The meeting heard IEC/TC65/JWG21 (Intelligent Manufacturing Reference Model), ISO/SMCC (Intelligent Manufacturing Coordinating Committee), JTC 1/SC 41 (Internet of Things and related technologies), SEG7/TF3 (Architecture and Model), etc. The latest situation in the standardization of smart manufacturing of technology organizations. The conference also referred to relevant definitions of "Intelligent Manufacturing" by China, Germany, France, ISO/SMCC, etc. The core content, application scope and key performance of intelligent manufacturing were discussed, and the final definition of SEG7's proposal was proposed.
Finally, the participating experts discussed heatedly the opinions of the SEG7 members on the final report, and accordingly revised the work report submitted by the working group to the SMB. The report includes the following resolutions: It is proposed to establish the Smart Manufacturing System Committee (SyC); to pass the initial scope of SyC (to provide cooperation and advice in the field of smart manufacturing to coordinate and promote the activities of smart manufacturing in IEC and other standards development organizations); to accept SyC Responsibilities and expected publications as work tasks within 12 months; Agreed to establish ISO/IEC Joint Task Group “Intelligent Manufacturing Standards Roadmap” in accordance with ISO/SMCC Recommendations; Suggestions for future intelligent manufacturing related in IEC and ISO Work was identified and supported by SyC; SEG 7 was dissolved at the first SyC meeting.
As an SEG7 domestic technology counterpart, Yihsing has organized the China Electronics Standardization Institute and the Shanghai Electric Apparatus Research Institute (Group) Co., Ltd. to jointly participate in the SEG7 related work. In the past year, it has provided domestic intelligence. The development of the manufacturing system architecture and standards system, definition of smart manufacturing, use cases, etc., added China's intelligent manufacturing system architecture to the final research report of SEG7, and contributed to and actively participated in the related work of IEC/TC65/JWG21. In the IEC/SMB/SyC (Intelligent Manufacturing System Committee) that may be established in the future, IGH will continue to perform its domestic technology counterparts, organize domestic experts to participate in SyC-related work, and introduce the structure of China's smart manufacturing standard system to international standardization. At the level, it strives for a place on top of the international standardization of smart manufacturing.
(Original title: I sent experts to participate in the IEC/SMB/SEG7 Intelligent Manufacturing Systems Evaluation Group Japan meeting)

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